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MADE IN THE USA. Available as Lead Free, No Clean solder paste, Water Soluble solder paste and Rosin Mildly Activated or RMA solder paste using the highest quality material with strict quality control of ISO9000. All of our solder paste products meet or exceeds J-STD-004/005 and QQ-S-571F standards.
Most of the products have tack time of 8 hours or more. Available in various alloys, most popular being SN63/PB37 and SN62/PB36/AG2. Packaging option varies from 250gm and 500gm jars to 700gm cartridges and 250gm aluminum tubes. Powder type 3 with Mesh size of -325 +500 is used for >16mil pitch, type 4 with Mesh size of -400 +500 for <16mil pitch and Fine mesh of -450 for <10mil pitch.
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LEAD FREE SOLDER PASTE: Formulation exhibit superior joint strength, excellent wettability and extraordinatry print definition and tack time. No-clean post solder residues are non-conductive, non-corrosive and are highly insulated. CALL 800-882-8665 X 106 FOR MORE INFORMATION |
NO CLEAN SOLDER PASTE: Formulated for fine pitch printability, increased stencil life, high tech force and good wetting. It meets higher performance standards such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls |
WATER SOLUBLE SOLDER PASTE: Formulated for fine pitch printability, increased stencil life, high tech force and good wetting. It meets higher performance standards such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls |
RMA SOLDER PASTE: Formulated for fine pitch printability, increased stencil life, high tech force and good wetting. It meets higher performance standards such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls
*** This is a special order product. Minimum order required***
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